Guoqing Hu
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Previous Organizations / Institutes
The organizations / institutes from the scholar's other articles in the past ten years
Guoqing Hu has a total of 19 co-authors. Here are the top co-authors by number of shared publications:
Boce Xue
2 shared publications- Jian-Wei Ma
School of Mechanical Engineering, Dalian University of Technology, Dalian 116024, China
2 shared publications Weiwei He
2 shared publicationsYanzhen Zhang
2 shared publicationsZi-Qi Zhou
Dalian University of Technology
2 shared publicationsGuofang Hu
1 shared publication
Latest Publications
- Open Access
- 9 October 2026
- Published by Elsevier in Additive Manufacturing Frontiers
3D-printed high-performance flexible strain sensors with integrated micro-porous and macro-biomimetic structures
- 9 October 2026
- Published by Elsevier in Additive Manufacturing Frontiers
Open Access3D-printed high-performance flexible strain sensors with integrated micro-porous and macro-biomimetic structures
- Open Access
Analytical Modeling and Structural Optimization of Slender Variable Cross-Section Rod for High-Speed Chip Placement
The cantilever pick-and-place arm of the high-speed placement machine is susceptible to micro-vibration and elastic deformation under high-acceleration motion, thereby degrading chip placement accuracy. To address this issue, this paper presents an analytical study on the natural frequency characteristics and structural optimization of slender variable-cross-section rods. First, based on the thin-walled shell theory, a displacement field model of the thin-walled cantilever rod is established. Second, combining the energy method and Hamilton’s principle, the undamped free vibration equation is derived. Using the Rayleigh–Ritz method with Chebyshev polynomials as the basis functions, an analytical calculation model for the natural frequency of the variable-section thin-walled rod is constructed. The model is validated against finite element simulations, and the relative errors of the low-order natural frequencies are controlled within 5%, confirming its favorable accuracy and robustness. Furthermore, the four-factor three-level orthogonal experiment is designed with the objective of maximizing natural frequency to conduct parameters sensitivity analysis. Accordingly, the optimal structural parameter combination ( = 8 mm, L1 = 10 mm, L2 = 50 mm, and L3 = 5 mm) is determined. Finally, the maximum dynamic deformation under high-acceleration motion decreases from 0.066 mm to 0.021 mm, a reduction of 68.2%, which effectively suppresses residual vibration and end displacement deviation. The analytical method proposed in this study provides a theoretical basis for the rapid dynamic performance evaluation of flexible components in high-speed precision equipment, and the optimization strategy can offer engineering references for the high-stiffness design of key components in chip placement machines.Open AccessAnalytical Modeling and Structural Optimization of Slender Variable Cross-Section Rod for High-Speed Chip Placement
The cantilever pick-and-place arm of the high-speed placement machine is susceptible to micro-vibration and elastic deformation under high-acceleration motion, thereby degrading chip placement accuracy. To address this issue, this paper presents an analytical study on the natural frequency characteristics and structural optimization of slender variable-cross-section rods. First, based on the thin-walled shell theory, a displacement field model of the thin-walled cantilever rod is established. Second, combining the energy method and Hamilton’s principle, the undamped free vibration equation is derived. Using the Rayleigh–Ritz method with Chebyshev polynomials as the basis functions, an analytical calculation model for the natural frequency of the variable-section thin-walled rod is constructed. The model is validated against finite element simulations, and the relative errors of the low-order natural frequencies are controlled within 5%, confirming its favorable accuracy and robustness. Furthermore, the four-factor three-level orthogonal experiment is designed with the objective of maximizing natural frequency to conduct parameters sensitivity analysis. Accordingly, the optimal structural parameter combination ( = 8 mm, L1 = 10 mm, L2 = 50 mm, and L3 = 5 mm) is determined. Finally, the maximum dynamic deformation under high-acceleration motion decreases from 0.066 mm to 0.021 mm, a reduction of 68.2%, which effectively suppresses residual vibration and end displacement deviation. The analytical method proposed in this study provides a theoretical basis for the rapid dynamic performance evaluation of flexible components in high-speed precision equipment, and the optimization strategy can offer engineering references for the high-stiffness design of key components in chip placement machines. - 24 March 2025
- Published by SAGE Publications in Journal of Vibration and Control
- Vol. 32 (9-10) , 2193-2209
Low residual vibration method at the end of picking arm based on fifth-order motion curve planning
Achieving high efficiency packaging under the premise of high precision is the goal pursued by the semiconductor packaging industry. The high-velocity and stable motion plays an important role in improving the efficiency and accuracy of chips patch. However, the discontinuous acceleration of the linear motor in high-velocity motion deteriorates the stability of pick-up arm, leads to large residual vibration and long settling time during chips patch, deteriorating the precision and productivity of precision packaging equipment. To address these challenges, this study proposes an innovative super S-curve with continuous acceleration profile based on Hermite interpolation to reduce the induced vibration of system. The equivalent jerk strategy is innovatively introduced to effectively relieve the computational burden of higher order polynomials. Then, the dynamics model of motion system is established, and the vibration response results are calculated and simulated to show the superior of the proposed motion profiles. Finally, the vibrations of proposed motion profile are measured by experiments and compared with other profiles. The results validate the proposed motion profile can significantly reduce the residual vibration by 24.1%, and can reduce the settling time by more than 7.1%. The proposed method can significantly obtain lower residual vibration, balancing both motion smoothness and computational complexity.
- 24 March 2025
- Published by SAGE Publications in Journal of Vibration and Control
- Vol. 32 (9-10) , 2193-2209
Low residual vibration method at the end of picking arm based on fifth-order motion curve planning
Achieving high efficiency packaging under the premise of high precision is the goal pursued by the semiconductor packaging industry. The high-velocity and stable motion plays an important role in improving the efficiency and accuracy of chips patch. However, the discontinuous acceleration of the linear motor in high-velocity motion deteriorates the stability of pick-up arm, leads to large residual vibration and long settling time during chips patch, deteriorating the precision and productivity of precision packaging equipment. To address these challenges, this study proposes an innovative super S-curve with continuous acceleration profile based on Hermite interpolation to reduce the induced vibration of system. The equivalent jerk strategy is innovatively introduced to effectively relieve the computational burden of higher order polynomials. Then, the dynamics model of motion system is established, and the vibration response results are calculated and simulated to show the superior of the proposed motion profiles. Finally, the vibrations of proposed motion profile are measured by experiments and compared with other profiles. The results validate the proposed motion profile can significantly reduce the residual vibration by 24.1%, and can reduce the settling time by more than 7.1%. The proposed method can significantly obtain lower residual vibration, balancing both motion smoothness and computational complexity.
- 6 June 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging and Manufacturing Technology
- Vol. 13 (5) , 724-736
An Offline Calculation and Analysis Method of Chips Patch Efficiency for Dual-Arms Mounter to Guide Parameter Optimization
Since high efficiency and low cost have become the leading trend of semiconductor packaging, dual-arms chips mounters have been widely used to eliminate the time delays and improve the efficiency. However, the auxiliary motion is required to avoid spatial interference, which increases the complexity of trajectory. In addition, the motion parameters need to be constantly adjusted online to balance the chips patch efficiency and operation stability. Whereas chips placement efficiency needs to online monitor, which is laborious, difficult to adjust the motion parameters rapidly. To off-line analyze the packaging efficiency, this paper establishes a calculation model for chips patch efficiency of dual-arms mounter, which accurately establish the quantitative relationship between motion parameters and efficiency, narrowing the selection range of motion parameters. Firstly, the process sequence of chips patch is constructed, and the efficiency calculation model is established. Secondly, considering the characteristics of the time-varying displacement, the method for solving the running time of each process under the flexible velocity control is proposed. Then, the chips patch efficiency is calculated for different parameters, and the effects of the motion parameters and the lead frame structures on chips patch efficiency are investigated, so as to optimize motion parameters. And simulation and calculation results of PTP motion are in good agreement with the experimental results, which provide an effective guidance for accurately calculating chips patch efficiency off-line and lays a foundation for selecting motion parameters.
- 6 June 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging and Manufacturing Technology
- Vol. 13 (5) , 724-736
An Offline Calculation and Analysis Method of Chips Patch Efficiency for Dual-Arms Mounter to Guide Parameter Optimization
Since high efficiency and low cost have become the leading trend of semiconductor packaging, dual-arms chips mounters have been widely used to eliminate the time delays and improve the efficiency. However, the auxiliary motion is required to avoid spatial interference, which increases the complexity of trajectory. In addition, the motion parameters need to be constantly adjusted online to balance the chips patch efficiency and operation stability. Whereas chips placement efficiency needs to online monitor, which is laborious, difficult to adjust the motion parameters rapidly. To off-line analyze the packaging efficiency, this paper establishes a calculation model for chips patch efficiency of dual-arms mounter, which accurately establish the quantitative relationship between motion parameters and efficiency, narrowing the selection range of motion parameters. Firstly, the process sequence of chips patch is constructed, and the efficiency calculation model is established. Secondly, considering the characteristics of the time-varying displacement, the method for solving the running time of each process under the flexible velocity control is proposed. Then, the chips patch efficiency is calculated for different parameters, and the effects of the motion parameters and the lead frame structures on chips patch efficiency are investigated, so as to optimize motion parameters. And simulation and calculation results of PTP motion are in good agreement with the experimental results, which provide an effective guidance for accurately calculating chips patch efficiency off-line and lays a foundation for selecting motion parameters.