Farnaz Sharif
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Previous Organizations / Institutes
The organizations / institutes from the scholar's other articles in the past ten years
Research Subjects
Farnaz Sharif has a total of 3 co-authors. Here are the top co-authors by number of shared publications:
Ali Karimi
Department of Bio-convergence Engineering, Korea University, Seoul, South Korea
1 shared publication- Behnam Tayebi
NYU Grossman School of Medicine (United States)
1 shared publication - Jae-Ho Han
Department of Brain and Cognitive Engineering, Korea University, Seoul 02841, Republic of Korea
1 shared publication
Latest Publications
- 8 February 2018
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Industrial Electronics
- Vol. 65 (10) , 8195-8203
Stable Extended Imaging Area Sensing Without Mechanical Movement Based on Spatial Frequency Multiplexing
Testing process in industrial profiling depends on the characterization of three-dimensional (3-D) objects with high sensitivity in spatial and temporal domains. Ordinary 3-D measurement instruments scan the image area in the temporal domain; therefore, these techniques experience low temporal stability especially for industrial and biomedical sensing. We propose a novel scan-free extended image instrument for sensing the area of 3-D microscopic objects using an interferometric technique with fixed optical parameters, such as resolution, and without mechanical movement. The technique could accelerate the control process in industrial fault detection and images of biological samples could be obtained in a shorter time. First, a stable system for doubling the image area is introduced. Second, the principles underlying the two-dimensional sampling scheme are introduced to record the maximum image area using a dual multiplexing technique at subsampling frequency. Moreover, a standard factor is presented as a figure of merit to determine the exact image area enhancement. Finally, the feasibility of this technique was demonstrated by sensing reflective and transparent objects with image area of up to 4.3-times that of a single-hologram recording using the square scheme. Furthermore, scan-free monitoring of the photolithography process was demonstrated in real-time. The standard deviation of thickness is 0.48 nm, which demonstrates the subnanometer temporal sensitivity of this technique.
- 8 February 2018
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Industrial Electronics
- Vol. 65 (10) , 8195-8203
Stable Extended Imaging Area Sensing Without Mechanical Movement Based on Spatial Frequency Multiplexing
Testing process in industrial profiling depends on the characterization of three-dimensional (3-D) objects with high sensitivity in spatial and temporal domains. Ordinary 3-D measurement instruments scan the image area in the temporal domain; therefore, these techniques experience low temporal stability especially for industrial and biomedical sensing. We propose a novel scan-free extended image instrument for sensing the area of 3-D microscopic objects using an interferometric technique with fixed optical parameters, such as resolution, and without mechanical movement. The technique could accelerate the control process in industrial fault detection and images of biological samples could be obtained in a shorter time. First, a stable system for doubling the image area is introduced. Second, the principles underlying the two-dimensional sampling scheme are introduced to record the maximum image area using a dual multiplexing technique at subsampling frequency. Moreover, a standard factor is presented as a figure of merit to determine the exact image area enhancement. Finally, the feasibility of this technique was demonstrated by sensing reflective and transparent objects with image area of up to 4.3-times that of a single-hologram recording using the square scheme. Furthermore, scan-free monitoring of the photolithography process was demonstrated in real-time. The standard deviation of thickness is 0.48 nm, which demonstrates the subnanometer temporal sensitivity of this technique.