Valeria Bertacco
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Valeria Bertacco has a total of 23 co-authors. Here are the top co-authors by number of shared publications:
- Aida Todri-Sanial
Eindhoven University of Technology
2 shared publications - Alberto Bosio
Cole Centrale de Lyon, cully, France
2 shared publications - Andy D. Pimentel
University of Amsterdam
2 shared publications - Robert Wille
Technical University of Munich, Munich, Germany
2 shared publications Theocharis Theocharides
University of Cyprus Aglantzia, Nicosia, Cyprus
2 shared publicationsAlessandro Danese
University of Verona, Verona, Italy
1 shared publication
Latest Publications
- 1 August 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Design & Test
- Vol. 43 (4) , 86-92
Date 2026 in Verona: Steady Growth, Industry Engagement, and Community in a Historic Setting
- 1 August 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Design & Test
- Vol. 43 (4) , 86-92
Date 2026 in Verona: Steady Growth, Industry Engagement, and Community in a Historic Setting
- 20 August 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Design & Test
- Vol. 42 (5) , 93-99
A Growing and Thriving Electronic Design, Automation, and Test Community: A DATE 2025 Perspective
The Design, Automation, and Test in Europe (DATE) Conference is a premier international event providing unique networking opportunities, bringing together designers and design automation users, researchers and vendors, and specialists in hardware and software design, test, and manufacturing of electronic circuits and systems.
- 20 August 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Design & Test
- Vol. 42 (5) , 93-99
A Growing and Thriving Electronic Design, Automation, and Test Community: A DATE 2025 Perspective
The Design, Automation, and Test in Europe (DATE) Conference is a premier international event providing unique networking opportunities, bringing together designers and design automation users, researchers and vendors, and specialists in hardware and software design, test, and manufacturing of electronic circuits and systems.
- 28 August 2024
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Design & Test
- Vol. 41 (5) , 87-94
DATE 2024: Consolidating the New Conference Format
- 28 August 2024
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Design & Test
- Vol. 41 (5) , 87-94
DATE 2024: Consolidating the New Conference Format
- Open Access
- 23 June 2024
- Published by Association for Computing Machinery (ACM)
- p. 1-6
Duet: A Collaborative User Driven Recommendation System for Edge Devices
- 23 June 2024
- Published by Association for Computing Machinery (ACM)
- p. 1-6
Open AccessDuet: A Collaborative User Driven Recommendation System for Edge Devices
- Open Access
- 28 October 2023
- Published by Association for Computing Machinery (ACM)
- p. 1016-1028
ACRE: Accelerating Random Forests for Explainability
As machine learning models become more widespread, they are being increasingly applied in applications that heavily impact people’s lives (e.g., medical diagnoses, judicial system sentences, etc.). Several communities are thus calling for ML models to be not only accurate, but also explainable. To achieve this, recommendations must be augmented with explanations summarizing how each recommendation outcome is derived. Explainable Random Forest (XRF) models are popular choices in this space, as they are both very accurate and can be augmented with explainability functionality, allowing end-users to learn how and why a specific outcome was reached. However, the limitations of XRF models hamper their adoption, the foremost being the high computational demands associated with training such models to support high-accuracy classifications, while also annotating them with explainability meta-data. In response, we present ACRE, a hardware accelerator to support XRF model training. ACRE accelerates key operations that bottleneck performance, while maintaining meta-data critical to support explainability. It leverages a novel Processing-in-Memory hardware unit, co-located with banks of a 3D-stacked High-Bandwidth Memory (HBM). The unit locally accelerates the execution of key training computations, boosting effective data-transfer bandwidth. Our evaluation shows that, when ACRE augments HBM3 memory, it yields an average system-level training performance improvement of 26.6x, compared to a baseline multicore processor solution with DDR4 memory. Further, ACRE yields a 2.5x improvement when compared to an HBM3 architecture baseline, increasing to 5x when not bottlenecked by a 16k-thread limit in the host. Finally, due to much higher performance, we observe that ACRE provides a 16.5x energy reduction overall, over a DDR baseline.
- 28 October 2023
- Published by Association for Computing Machinery (ACM)
- p. 1016-1028
Open AccessACRE: Accelerating Random Forests for Explainability
As machine learning models become more widespread, they are being increasingly applied in applications that heavily impact people’s lives (e.g., medical diagnoses, judicial system sentences, etc.). Several communities are thus calling for ML models to be not only accurate, but also explainable. To achieve this, recommendations must be augmented with explanations summarizing how each recommendation outcome is derived. Explainable Random Forest (XRF) models are popular choices in this space, as they are both very accurate and can be augmented with explainability functionality, allowing end-users to learn how and why a specific outcome was reached. However, the limitations of XRF models hamper their adoption, the foremost being the high computational demands associated with training such models to support high-accuracy classifications, while also annotating them with explainability meta-data. In response, we present ACRE, a hardware accelerator to support XRF model training. ACRE accelerates key operations that bottleneck performance, while maintaining meta-data critical to support explainability. It leverages a novel Processing-in-Memory hardware unit, co-located with banks of a 3D-stacked High-Bandwidth Memory (HBM). The unit locally accelerates the execution of key training computations, boosting effective data-transfer bandwidth. Our evaluation shows that, when ACRE augments HBM3 memory, it yields an average system-level training performance improvement of 26.6x, compared to a baseline multicore processor solution with DDR4 memory. Further, ACRE yields a 2.5x improvement when compared to an HBM3 architecture baseline, increasing to 5x when not bottlenecked by a 16k-thread limit in the host. Finally, due to much higher performance, we observe that ACRE provides a 16.5x energy reduction overall, over a DDR baseline.
- 28 August 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Design & Test
- Vol. 40 (5) , 104-112
Postpandemic Conferences: The DATE 2023 Experience
Date is a leading international event providing unique networking opportunities. The conference brings together designers and design automation users, researchers, and vendors, as well as specialists in hardware and software design, testing, and manufacturing of electronic circuits and systems—from system-level hardware and software implementation down to integrated circuit design.
- 28 August 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Design & Test
- Vol. 40 (5) , 104-112
Postpandemic Conferences: The DATE 2023 Experience
Date is a leading international event providing unique networking opportunities. The conference brings together designers and design automation users, researchers, and vendors, as well as specialists in hardware and software design, testing, and manufacturing of electronic circuits and systems—from system-level hardware and software implementation down to integrated circuit design.
- Open Access
- 10 July 2022
- Published by Association for Computing Machinery (ACM)
- p. 1406-1409
ADA, the Center for Applications Driving Architectures: accomplishments and vision forward
The ADA Center set out in 2018 to reignite innovation in computing and to enable the design of computing systems for the 2030 decade. It planned to do so by developing novel hardware architecture solutions, embracing emerging devices at the system's scale, and crafting new design flows that are accessible to a much larger engineering population than today. This work provides a retrospective of ADA's accomplishments, and lessons learned along the way. It also provides a discussion of future research directions informed by the ADA Center's learning.
- 10 July 2022
- Published by Association for Computing Machinery (ACM)
- p. 1406-1409
Open AccessADA, the Center for Applications Driving Architectures: accomplishments and vision forward
The ADA Center set out in 2018 to reignite innovation in computing and to enable the design of computing systems for the 2030 decade. It planned to do so by developing novel hardware architecture solutions, embracing emerging devices at the system's scale, and crafting new design flows that are accessible to a much larger engineering population than today. This work provides a retrospective of ADA's accomplishments, and lessons learned along the way. It also provides a discussion of future research directions informed by the ADA Center's learning.
- 1 October 2021
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 395-399
Chopin: Composing Cost-Effective Custom Chips with Algorithmic Chiplets
As computational demands rise, the need for specialized hardware has grown acute. However, the immense cost of fully-custom chips has forced many developers to rely on suboptimal solutions like FPGAs, especially for low- to mid-volume applications, in which multi-million-dollar non-recurring engineering (NRE) costs cannot be amortized effectively. We propose to address this problem by composing custom chips out of small, algorithmic chiplets, reusable across diverse designs, such that high NRE costs may be amortized across many different designs. This work models the economics of this paradigm and identifies a cost-optimal granularity for algorithmic chiplets, then demonstrates how those guidelines may be applied to design high-performance, algorithmically-composable hardware components – which may be reused, without modification, across many different processing pipelines. For an example phased-array radar accelerator, our chiplet-centric paradigm improves perf-per-$ by 9.3× over an FPGA, and ∼4× over a conventional ASIC.
- 1 October 2021
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 395-399
Chopin: Composing Cost-Effective Custom Chips with Algorithmic Chiplets
As computational demands rise, the need for specialized hardware has grown acute. However, the immense cost of fully-custom chips has forced many developers to rely on suboptimal solutions like FPGAs, especially for low- to mid-volume applications, in which multi-million-dollar non-recurring engineering (NRE) costs cannot be amortized effectively. We propose to address this problem by composing custom chips out of small, algorithmic chiplets, reusable across diverse designs, such that high NRE costs may be amortized across many different designs. This work models the economics of this paradigm and identifies a cost-optimal granularity for algorithmic chiplets, then demonstrates how those guidelines may be applied to design high-performance, algorithmically-composable hardware components – which may be reused, without modification, across many different processing pipelines. For an example phased-array radar accelerator, our chiplet-centric paradigm improves perf-per-$ by 9.3× over an FPGA, and ∼4× over a conventional ASIC.