Saeid Karimpour
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Saeid Karimpour has a total of 18 co-authors. Here are the top co-authors by number of shared publications:
- Degang Chen
Department of Electrical and Computer Engineering, Iowa State University, Ames, IA 50011, USA
10 shared publications - Emmanuel Nti Darko
Department of Electrical and Computer Engineering, Iowa State University, Ames, IA 50011, USA
9 shared publications - Isaac Bruce
Department of Electrical and Computer Engineering, Iowa State University, Ames, IA 50011, USA
5 shared publications - Colin C. McAndrew
Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, USA
3 shared publications - Michael Sekyere
Department of Electrical and Computer Engineering (ECpE), Iowa State University
3 shared publications - Babar Ali
Department of Electrical and Computer Engineering, Iowa State University, Ames, IA 50011, USA
2 shared publications
Latest Publications
- Open Access
Deterministic Foreground Calibration of Gain and Integral Nonlinearity in Constant-Slope Digital-to-Time Converters for Fractional Output Dividers
Fractional output dividers (FODs) derive many clock domains from one integer-N phase-locked loop, but the gain error and integral nonlinearity (INL) of their digital-to-time converter (DTC) limit spectral purity. Existing FOD calibrations estimate the INL statistically, with no deterministic step count or residual bound. This paper presents a deterministic foreground calibration that measures the DTC bit weights in the delay domain. Reconfiguring an R-2R ladder bit by bit inside a constant-slope DTC maps each weight to a SAR-driven edge comparison against a replica chain, so the five mismatch-dominant weights are extracted inside a fixed 124-decision sequence and corrected through a 32-entry look-up table. Allocating one input period to discharge and periods to DAC settling enables a 10 GHz input. Exact conditions are derived for gain measurement, offset–gain convergence, and weight extraction, together with the smooth curvature that per-bit calibration cannot observe. Transistor-level simulations in 22 nm FDSOI show chain tracking of 0.94 and offset–gain convergence below half the 12.2 fs calibration step. A 200-die system-level Monte Carlo anchored to these statistics reduces the median peak INL from 4.1 to 0.32 LSB (24.4 fs LSB) and the worst fractional spur from dBc to the dBc quantization floor after 0.59 ms of calibration; the resulting 28 fs rms edge jitter permits 95 dB aperture-limited SNDR in a sampled sensor front end at 100 MHz.Open AccessDeterministic Foreground Calibration of Gain and Integral Nonlinearity in Constant-Slope Digital-to-Time Converters for Fractional Output Dividers
Fractional output dividers (FODs) derive many clock domains from one integer-N phase-locked loop, but the gain error and integral nonlinearity (INL) of their digital-to-time converter (DTC) limit spectral purity. Existing FOD calibrations estimate the INL statistically, with no deterministic step count or residual bound. This paper presents a deterministic foreground calibration that measures the DTC bit weights in the delay domain. Reconfiguring an R-2R ladder bit by bit inside a constant-slope DTC maps each weight to a SAR-driven edge comparison against a replica chain, so the five mismatch-dominant weights are extracted inside a fixed 124-decision sequence and corrected through a 32-entry look-up table. Allocating one input period to discharge and periods to DAC settling enables a 10 GHz input. Exact conditions are derived for gain measurement, offset–gain convergence, and weight extraction, together with the smooth curvature that per-bit calibration cannot observe. Transistor-level simulations in 22 nm FDSOI show chain tracking of 0.94 and offset–gain convergence below half the 12.2 fs calibration step. A 200-die system-level Monte Carlo anchored to these statistics reduces the median peak INL from 4.1 to 0.32 LSB (24.4 fs LSB) and the worst fractional spur from dBc to the dBc quantization floor after 0.59 ms of calibration; the resulting 28 fs rms edge jitter permits 95 dB aperture-limited SNDR in a sampled sensor front end at 100 MHz. - Open Access
- 7 September 2026
- Published by MDPI AG in Electronics
- Vol. 15 (17) , 4036
A Back-Gate Corner-Closure Methodology for All-Digital Multi-Modulus Dividers in 22 nm FDSOI
The first divider in the feedback path of a frequency synthesizer runs at the full oscillator frequency and so constrains the speed and the power of the loop. Current-mode logic reaches high speed but draws a constant bias current independent of switching activity, whereas an all-digital, fully static-CMOS divider draws only dynamic and leakage current at the cost of far greater timing sensitivity to process, voltage, and temperature (PVT) variation. This paper presents a wide-range all-digital multi-modulus divider in 22 nm fully depleted silicon-on-insulator (FDSOI) technology, together with the methodology that makes the digital approach robust. The chain exhibits three distinct PVT failure modes, setup at the slow corners, hold at the fast-cold corner, and collapse of the internal clock duty cycle at the skewed corners; each is identified analytically and closed by a scheme combining back-gate body bias, a per-stage programmable delay trim, and a systematic integral-nonlinearity trim. Characterization is by post-layout simulation over a 45-point corner matrix, with the applied back-gate rail voltages and trim codes reported for every point. The divider covers 8 to 127, reaches GHz at the typical corner, and holds a worst-case GHz across the corner box against a 33 GHz target that the uncompensated chain misses at the slow and skewed low-supply corners (SS, SF, and FS at V). A paired Monte Carlo campaign of 100 samples with process and mismatch variation, run at the binding corner, raises the yield at the target from 39% uncompensated to 72% with a single global back-gate setting and 99% with a per-die setting. At the target the divider consumes mW at ( GHz/mW) with fs of additive jitter in a core. The bias and trim settings are chosen by an external search and applied as fixed per-corner values; the monitors, controller, and bias generator that an autonomous implementation would require are specified but not designed, so the work demonstrates externally calibrated corner closure rather than a self-contained compensation system.- 7 September 2026
- Published by MDPI AG in Electronics
- Vol. 15 (17) , 4036
Open AccessA Back-Gate Corner-Closure Methodology for All-Digital Multi-Modulus Dividers in 22 nm FDSOI
The first divider in the feedback path of a frequency synthesizer runs at the full oscillator frequency and so constrains the speed and the power of the loop. Current-mode logic reaches high speed but draws a constant bias current independent of switching activity, whereas an all-digital, fully static-CMOS divider draws only dynamic and leakage current at the cost of far greater timing sensitivity to process, voltage, and temperature (PVT) variation. This paper presents a wide-range all-digital multi-modulus divider in 22 nm fully depleted silicon-on-insulator (FDSOI) technology, together with the methodology that makes the digital approach robust. The chain exhibits three distinct PVT failure modes, setup at the slow corners, hold at the fast-cold corner, and collapse of the internal clock duty cycle at the skewed corners; each is identified analytically and closed by a scheme combining back-gate body bias, a per-stage programmable delay trim, and a systematic integral-nonlinearity trim. Characterization is by post-layout simulation over a 45-point corner matrix, with the applied back-gate rail voltages and trim codes reported for every point. The divider covers 8 to 127, reaches GHz at the typical corner, and holds a worst-case GHz across the corner box against a 33 GHz target that the uncompensated chain misses at the slow and skewed low-supply corners (SS, SF, and FS at V). A paired Monte Carlo campaign of 100 samples with process and mismatch variation, run at the binding corner, raises the yield at the target from 39% uncompensated to 72% with a single global back-gate setting and 99% with a per-die setting. At the target the divider consumes mW at ( GHz/mW) with fs of additive jitter in a core. The bias and trim settings are chosen by an external search and applied as fixed per-corner values; the monitors, controller, and bias generator that an autonomous implementation would require are specified but not designed, so the work demonstrates externally calibrated corner closure rather than a self-contained compensation system. - Open Access
- 28 July 2026
- Published by MDPI AG in Preprints.org
A PVT-Compensated All-Digital Multi-Modulus Divider in 22 nm FDSOI Using Back-Gate Corner Closure
The first divider in an integer- or fractional-N frequency synthesizer runs at the full oscillator frequency and so constrains both the speed and the power of the loop. Current-mode logic (CML) reaches high speed but draws a constant bias current independent of activity, whereas a fully static-CMOS (all-digital) divider draws only dynamic and leakage current at the cost of much greater timing sensitivity to process, voltage, and temperature (PVT) variation. This paper presents a wide-range all-digital multi-modulus divider in a 22 nm fully depleted silicon-on-insulator (FDSOI) technology, characterized entirely by post-layout and Monte Carlo simulation, together with the methodology that makes the timing-sensitive digital approach robust. The all-digital chain exhibits three PVT failure modes, setup at the slow-hot corner, hold at the fast-cold corner, and internal duty-cycle collapse at the skewed corners; each is predicted analytically and closed by a three-method scheme built on the FDSOI back gate, a per-stage delay trim, and a systematic integral-nonlinearity trim. The divider covers N=8 to 127 at up to 39.5 GHz at the typical corner, with every process corner held at or above 35 GHz by back-gate compensation, the highest speed among the compared dividers and the only one with explicit PVT compensation. At the 33 GHz target it consumes 5.3 mW at N=127 (6.2 GHz/mW) with an activity-scaling supply current, benchmarked against the measured power of published CML dividers. Per-die body-bias and trim raise the Monte Carlo yield from 78% to 99.3%, at 150 fs additive jitter, in a compact 0.005 mm2 core.
- 28 July 2026
- Published by MDPI AG in Preprints.org
Open AccessA PVT-Compensated All-Digital Multi-Modulus Divider in 22 nm FDSOI Using Back-Gate Corner Closure
The first divider in an integer- or fractional-N frequency synthesizer runs at the full oscillator frequency and so constrains both the speed and the power of the loop. Current-mode logic (CML) reaches high speed but draws a constant bias current independent of activity, whereas a fully static-CMOS (all-digital) divider draws only dynamic and leakage current at the cost of much greater timing sensitivity to process, voltage, and temperature (PVT) variation. This paper presents a wide-range all-digital multi-modulus divider in a 22 nm fully depleted silicon-on-insulator (FDSOI) technology, characterized entirely by post-layout and Monte Carlo simulation, together with the methodology that makes the timing-sensitive digital approach robust. The all-digital chain exhibits three PVT failure modes, setup at the slow-hot corner, hold at the fast-cold corner, and internal duty-cycle collapse at the skewed corners; each is predicted analytically and closed by a three-method scheme built on the FDSOI back gate, a per-stage delay trim, and a systematic integral-nonlinearity trim. The divider covers N=8 to 127 at up to 39.5 GHz at the typical corner, with every process corner held at or above 35 GHz by back-gate compensation, the highest speed among the compared dividers and the only one with explicit PVT compensation. At the 33 GHz target it consumes 5.3 mW at N=127 (6.2 GHz/mW) with an activity-scaling supply current, benchmarked against the measured power of published CML dividers. Per-die body-bias and trim raise the Monte Carlo yield from 78% to 99.3%, at 150 fs additive jitter, in a compact 0.005 mm2 core.
- Open Access
A Fully Integrated Monolithic Monitor for Aging-Induced Leakage Current Characterization
This paper presents a precision, wide-dynamic-range leakage current sensor tailored for in-situ monitoring of aging mechanisms such as Time-Dependent Dielectric Breakdown (TDDB) in both active and passive components. The proposed architecture supports high-voltage stress and is fully monolithic, integrating a current-to-voltage front-end, tunable-gain amplifier, and a successive approximation register (SAR) analog-to-digital converter (ADC). To validate the concept, a discrete-component prototype was implemented and evaluated across a leakage current range of 1 nA to 1 A. The sensor achieves 12-bit resolution with measured integral non-linearity (INL) and differential non-linearity (DNL) within LSB and LSB, respectively. Compared to prior monitors, the design enables linear current digitization and supports high-voltage stress, features essential for accurate and scalable TDDB characterization. Applications include embedded reliability monitoring in power converters, analog building blocks, and large-scale aging test arrays.Open AccessA Fully Integrated Monolithic Monitor for Aging-Induced Leakage Current Characterization
This paper presents a precision, wide-dynamic-range leakage current sensor tailored for in-situ monitoring of aging mechanisms such as Time-Dependent Dielectric Breakdown (TDDB) in both active and passive components. The proposed architecture supports high-voltage stress and is fully monolithic, integrating a current-to-voltage front-end, tunable-gain amplifier, and a successive approximation register (SAR) analog-to-digital converter (ADC). To validate the concept, a discrete-component prototype was implemented and evaluated across a leakage current range of 1 nA to 1 A. The sensor achieves 12-bit resolution with measured integral non-linearity (INL) and differential non-linearity (DNL) within LSB and LSB, respectively. Compared to prior monitors, the design enables linear current digitization and supports high-voltage stress, features essential for accurate and scalable TDDB characterization. Applications include embedded reliability monitoring in power converters, analog building blocks, and large-scale aging test arrays. - Open Access
- 14 November 2025
- Published by MDPI AG in Preprints.org
A Fully Integrated Monolithic Monitor for Aging-Induced Leakage Current Characterization
This paper presents a precision, wide-dynamic-range leakage current sensor tailored for in-situ monitoring of aging mechanisms such as Time-Dependent Dielectric Breakdown (TDDB) in both active and passive components. The proposed architecture supports high-voltage stress and is fully monolithic, integrating a current-to-voltage front-end, tunable gain amplifier, and a successive approximation register (SAR) analog-to-digital converter (ADC). To validate the concept, a discrete-component prototype was implemented and evaluated across a leakage current range of 1nA to 1 μA. The sensor achieves 12-bit resolution with measured integral nonlinearity (INL) and differential nonlinearity (DNL) within ±1.5 LSB and ±0.3 LSB, respectively. Compared to prior monitors, the design enables linear current digitization and compatibility with high-voltage stress, features essential for accurate and scalable TDDB characterization. Applications include embedded reliability monitoring in power converters, analog building blocks, and large-scale aging test arrays.
- 14 November 2025
- Published by MDPI AG in Preprints.org
Open AccessA Fully Integrated Monolithic Monitor for Aging-Induced Leakage Current Characterization
This paper presents a precision, wide-dynamic-range leakage current sensor tailored for in-situ monitoring of aging mechanisms such as Time-Dependent Dielectric Breakdown (TDDB) in both active and passive components. The proposed architecture supports high-voltage stress and is fully monolithic, integrating a current-to-voltage front-end, tunable gain amplifier, and a successive approximation register (SAR) analog-to-digital converter (ADC). To validate the concept, a discrete-component prototype was implemented and evaluated across a leakage current range of 1nA to 1 μA. The sensor achieves 12-bit resolution with measured integral nonlinearity (INL) and differential nonlinearity (DNL) within ±1.5 LSB and ±0.3 LSB, respectively. Compared to prior monitors, the design enables linear current digitization and compatibility with high-voltage stress, features essential for accurate and scalable TDDB characterization. Applications include embedded reliability monitoring in power converters, analog building blocks, and large-scale aging test arrays.
- Open Access
- 12 November 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in TechRxiv
A Low-Power, High-Resolution DIDC for Non-Invasive Current Sensing in SoC Power Delivery Networks
This paper presents a compact and energyefficient Direct Current-to-Digital Converter (DIDC) for realtime on-chip current sensing, implemented in 180 nm CMOS technology using 1.8 V devices. The proposed design eliminates the need for bulky resistors or explicit analog-to digital converter employing a fully MOSFET-based architecture with a successive approximation register (SAR)-controlled compensation loop and a binary-weighted R-2R digital-to-analog converter (DAC). The system targets power delivery networks (PDNs), enabling non-intrusive monitoring of IR drop to infer local current levels with high accuracy. Simulation results demonstrate reliable operation across a wide current range 0 A to 9 A, with robust performance over temperature variations from −10 • C to 120 • C. The design achieves 9-bit resolution at 12 MHz with a total power consumption of only 365 µW.
- 12 November 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in TechRxiv
Open AccessA Low-Power, High-Resolution DIDC for Non-Invasive Current Sensing in SoC Power Delivery Networks
This paper presents a compact and energyefficient Direct Current-to-Digital Converter (DIDC) for realtime on-chip current sensing, implemented in 180 nm CMOS technology using 1.8 V devices. The proposed design eliminates the need for bulky resistors or explicit analog-to digital converter employing a fully MOSFET-based architecture with a successive approximation register (SAR)-controlled compensation loop and a binary-weighted R-2R digital-to-analog converter (DAC). The system targets power delivery networks (PDNs), enabling non-intrusive monitoring of IR drop to infer local current levels with high accuracy. Simulation results demonstrate reliable operation across a wide current range 0 A to 9 A, with robust performance over temperature variations from −10 • C to 120 • C. The design achieves 9-bit resolution at 12 MHz with a total power consumption of only 365 µW.
- 28 June 2025
- Published by Springer Nature in Circuits, Systems, and Signal Processing
- Vol. 45 (1) , 131-152
Gradient Minimization in Layout Patterns for Analog Circuits
- 28 June 2025
- Published by Springer Nature in Circuits, Systems, and Signal Processing
- Vol. 45 (1) , 131-152
Gradient Minimization in Layout Patterns for Analog Circuits
- Open Access
Low-Cost Direct Digital Synthesis-Based On-Chip Waveform Generation for Analog/Mixed Signal BIST Applications
Waveform generation as part of on-chip built-in self-test (BIST) circuitry often necessitates sufficient linearity without expensive hardware overhead. Achieving high linearity is critical for accurate signal generation, especially in applications requiring high precision, such as biomedical and instrumentation applications. Currently, achieving the high linearity and precision required in signal generators often relies on costly hardware such as automated test equipment (ATE). This paper presents a DAC-based arbitrary waveform generator (AWG). We use a low-cost DAC and a fully digital on-chip testing and calibration approach to nullify the effect of the DAC’s non-linearity on the generated waveform. The ultra-low cost and high linearity benefit of the proposed waveform generator makes it highly suitable for integration into resource-constrained systems. The proposed approach is validated using simulation results of the small-area DAC designed in TSMC 0.18 μm technology and the testing and calibration algorithms implemented in MATLAB. The DAC, designed with a matching accuracy at only the 5-bit level, is able to generate a signal with an ENOB of 12 bits alongside an SFDR and THD surpassing 100 dB. This high level of signal purity is consistently maintained across 100 Monte Carlo simulations, demonstrating the robustness of the architecture against PVT variations as well as random mismatches.
Open AccessLow-Cost Direct Digital Synthesis-Based On-Chip Waveform Generation for Analog/Mixed Signal BIST Applications
Waveform generation as part of on-chip built-in self-test (BIST) circuitry often necessitates sufficient linearity without expensive hardware overhead. Achieving high linearity is critical for accurate signal generation, especially in applications requiring high precision, such as biomedical and instrumentation applications. Currently, achieving the high linearity and precision required in signal generators often relies on costly hardware such as automated test equipment (ATE). This paper presents a DAC-based arbitrary waveform generator (AWG). We use a low-cost DAC and a fully digital on-chip testing and calibration approach to nullify the effect of the DAC’s non-linearity on the generated waveform. The ultra-low cost and high linearity benefit of the proposed waveform generator makes it highly suitable for integration into resource-constrained systems. The proposed approach is validated using simulation results of the small-area DAC designed in TSMC 0.18 μm technology and the testing and calibration algorithms implemented in MATLAB. The DAC, designed with a matching accuracy at only the 5-bit level, is able to generate a signal with an ENOB of 12 bits alongside an SFDR and THD surpassing 100 dB. This high level of signal purity is consistently maintained across 100 Monte Carlo simulations, demonstrating the robustness of the architecture against PVT variations as well as random mismatches.
- Open Access
Direct Current to Digital Converter (DIDC): A Current Sensor
This paper introduces a systematic approach to the design of Direct Current-to-Digital Converter (DIDC) specifically engineered to overcome the limitations of traditional current measurement methodologies in System-on-Chip (SoC) designs. The proposed DIDC addresses critical challenges such as high power consumption, large area requirements, and the need for intermediate analog signals. By incorporating a current mirror in a cascode topology and managing the current across multiple binary-sized branches with the Successive Approximation Register (SAR) logic, the design achieves precise current measurement. A simple comparator, coupled with an isolation circuit, ensures accurate and reliable sensing. Fabricated using the TSMC 180 nm process, the DIDC achieves 8-bit precision without the need for nonlinearity calibration, showcasing remarkable energy efficiency with an energy per conversion of 1.52 pJ, power consumption of 117 µW, and a compact area of 0.016 mm². This innovative approach not only reduces power consumption and area, but also provides a scalable and efficient solution for next-generation semiconductor technologies. The ability to conduct online measurements during both standard operations and in-field conditions significantly enhances the performance and reliability of SoCs, making this DIDC a promising advancement in the field.
Open AccessDirect Current to Digital Converter (DIDC): A Current Sensor
This paper introduces a systematic approach to the design of Direct Current-to-Digital Converter (DIDC) specifically engineered to overcome the limitations of traditional current measurement methodologies in System-on-Chip (SoC) designs. The proposed DIDC addresses critical challenges such as high power consumption, large area requirements, and the need for intermediate analog signals. By incorporating a current mirror in a cascode topology and managing the current across multiple binary-sized branches with the Successive Approximation Register (SAR) logic, the design achieves precise current measurement. A simple comparator, coupled with an isolation circuit, ensures accurate and reliable sensing. Fabricated using the TSMC 180 nm process, the DIDC achieves 8-bit precision without the need for nonlinearity calibration, showcasing remarkable energy efficiency with an energy per conversion of 1.52 pJ, power consumption of 117 µW, and a compact area of 0.016 mm². This innovative approach not only reduces power consumption and area, but also provides a scalable and efficient solution for next-generation semiconductor technologies. The ability to conduct online measurements during both standard operations and in-field conditions significantly enhances the performance and reliability of SoCs, making this DIDC a promising advancement in the field.
- Open Access
- 24 September 2024
- Published by MDPI AG in Preprints.org
A Low-Cost Direct Digital Synthesis Based On-Chip Waveform Generation for Analog/Mixed Signal BIST Applications
Waveform generation as part of an on-chip built-in self-test (BIST) circuitry often necessitates sufficient linearity without expensive hardware overhead. Achieving high linearity is critical for accurate signal generation, especially in applications requiring high precision, such as biomedical and instrumentation. Currently, achieving the high linearity and precision required in signal generators often relies on costly hardware such as automated test equipment (ATE). This paper presents a DAC based hardware synthesizable arbitrary waveform generator. We use a low-cost DAC and a fully digital on-chip testing and calibration approach to nullify the effect of the DAC’s non-linearity on the generated waveform. The ultra-low cost and high linearity benefit of the proposed waveform generator makes it highly suitable for integration into resource-constrained systems. The proposed approach is validated using simulation results of the small-area DAC designed in TSMC 0.18um technology and the testing and calibration algorithms implemented in MATLAB. The DAC, designed with a matching accuracy at only the 5-bit level, is able to generate a signal with an ENOB of 12 bits alongside a SFDR and THD surpassing 100 dB. This high level of signal purity is consistently maintained across 100 Monte-Carlo simulations, demonstrating the robustness of the architecture against PVT variations as well as random mismatches.
- 24 September 2024
- Published by MDPI AG in Preprints.org
Open AccessA Low-Cost Direct Digital Synthesis Based On-Chip Waveform Generation for Analog/Mixed Signal BIST Applications
Waveform generation as part of an on-chip built-in self-test (BIST) circuitry often necessitates sufficient linearity without expensive hardware overhead. Achieving high linearity is critical for accurate signal generation, especially in applications requiring high precision, such as biomedical and instrumentation. Currently, achieving the high linearity and precision required in signal generators often relies on costly hardware such as automated test equipment (ATE). This paper presents a DAC based hardware synthesizable arbitrary waveform generator. We use a low-cost DAC and a fully digital on-chip testing and calibration approach to nullify the effect of the DAC’s non-linearity on the generated waveform. The ultra-low cost and high linearity benefit of the proposed waveform generator makes it highly suitable for integration into resource-constrained systems. The proposed approach is validated using simulation results of the small-area DAC designed in TSMC 0.18um technology and the testing and calibration algorithms implemented in MATLAB. The DAC, designed with a matching accuracy at only the 5-bit level, is able to generate a signal with an ENOB of 12 bits alongside a SFDR and THD surpassing 100 dB. This high level of signal purity is consistently maintained across 100 Monte-Carlo simulations, demonstrating the robustness of the architecture against PVT variations as well as random mismatches.