Samuel J. Klein
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Interests
Samuel J. Klein has a total of 7 co-authors. Here are the top co-authors by number of shared publications:
- Fred Wang
The University of Tennessee
2 shared publications - Hua Bai
The University of Tennessee
2 shared publications - Ruirui Chen
The University of Tennessee
2 shared publications - Xingyue Tian
The University of Tennessee
2 shared publications - Yang Xu
The University of Tennessee
2 shared publications - Ching-Hsiang Yang
Department of Electrical Engineering and Computer Science, University of Tennessee, Knoxville, TN, USA
1 shared publication
Latest Publications
- 1 November 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Power Electronics
- Vol. 41 (11) , 19066-19078
Differential-Mode Instability Analysis and Gate-Impedance Shaping for Parallel-Connected Medium-Voltage SiC MOSFETs
- 1 November 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Power Electronics
- Vol. 41 (11) , 19066-19078
Differential-Mode Instability Analysis and Gate-Impedance Shaping for Parallel-Connected Medium-Voltage SiC MOSFETs
- 16 March 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Power Electronics
- Vol. 41 (8) , 12802-12814
A Coaxial Package Design for 1.7 kV Stacked Transient Voltage Suppression Diodes
High-power transient voltage suppression (TVS) diodes serve as the primary energy-absorbing elements in solid-state circuit breakers (SSCBs), providing rapid clamping of over voltages that threaten main interrupting devices. This paper presents a coaxial packaging solution for stacked TVS diodes, which achieves a dramatic reduction in commutation loop inductance from 95 nH to 3.8 nH, resulting in an approximately 96% reduction. Experimental validation, which demonstrates a substantial decrease in turn-off overvoltage from 950 V to 300 V, shows an approximate 68% reduction. A derived modular design is further proposed to achieve higher voltage ratings, enabling scalable deployment across different SSCB applications. The package performance is evaluated through finite element analysis (FEA) of inductance and electric field distribution and experimentally confirmed in a 1.7 kV/100 A SSCB. Results verify that the proposed coaxial package effectively mitigates loop inductance and overvoltage, enhancing both reliability and operational safety of high-power SSCBs.
- 16 March 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Power Electronics
- Vol. 41 (8) , 12802-12814
A Coaxial Package Design for 1.7 kV Stacked Transient Voltage Suppression Diodes
High-power transient voltage suppression (TVS) diodes serve as the primary energy-absorbing elements in solid-state circuit breakers (SSCBs), providing rapid clamping of over voltages that threaten main interrupting devices. This paper presents a coaxial packaging solution for stacked TVS diodes, which achieves a dramatic reduction in commutation loop inductance from 95 nH to 3.8 nH, resulting in an approximately 96% reduction. Experimental validation, which demonstrates a substantial decrease in turn-off overvoltage from 950 V to 300 V, shows an approximate 68% reduction. A derived modular design is further proposed to achieve higher voltage ratings, enabling scalable deployment across different SSCB applications. The package performance is evaluated through finite element analysis (FEA) of inductance and electric field distribution and experimentally confirmed in a 1.7 kV/100 A SSCB. Results verify that the proposed coaxial package effectively mitigates loop inductance and overvoltage, enhancing both reliability and operational safety of high-power SSCBs.