Effects of surface finishes and loading speeds on shear strength of Sn–3.0Ag–0.5Cu solder joints
Authors:
- Jae-Myeong KimJKJae-Myeong Kim
- Myeong-Hyeok JeongMJMyeong-Hyeok Jeong
- Sehoon YooSYSehoon Yoo
- Chang-Woo LeeCLChang-Woo Lee
- Young-Bae ParkYPYoung-Bae Park
- 1 January 2012
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 89, 55-57
Abstract
No abstract availableKeywords
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