Recent Advances and New Trends in Flip Chip Technology
Author:
Top Cited Papers
- 25 July 2016
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 138 (3) , 030802
Abstract
Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be presented in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended.Keywords
This publication has 98 references indexed in Scilit:
- Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) InterposerIEEE Transactions on Components, Packaging and Manufacturing Technology, 2011
- Overview and outlook of through‐silicon via (TSV) and 3D integrationsMicroelectronics International, 2011
- Characteristics and reliability of fast-flow, snap-cure, and reworkable underfills for solder bumped flip chip on low-cost substratesIEEE Transactions on Electronics Packaging Manufacturing, 2002
- Taguchi design of experiment for wafer bumping by stencil printingIEEE Transactions on Electronics Packaging Manufacturing, 2000
- Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect UnderfillsJournal of Electronic Packaging, 2000
- Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulantsIEEE Transactions on Components and Packaging Technologies, 2000
- Failure analysis of solder bumped flip chip on low-cost substratesIEEE Transactions on Electronics Packaging Manufacturing, 2000
- Characterization of underfill materials for functional solder bumped flip chips on board applicationsIEEE Transactions on Components and Packaging Technologies, 1999
- Characterisation and Evaluation of the Underfill Encapsulants for Flip Chip AssemblyCircuit World, 1995
- Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit BoardsCircuit World, 1993