Multiphysics design and fabrication of 3D electroplated VIA materials topographies for next generation energy and sensor technologies
Authors:
- Daniel C. SmallwoodDSDaniel C. Smallwood
- Paul McCloskeyPMPaul McCloskey
- James F. RohanJRJames F. Rohan
Open Access
- 30 July 2022
- journal article
- research article
- Published by Elsevier in Materials & Design
- Vol. 221
Abstract
No abstract availableKeywords
Funding Information
- Science Foundation Ireland (15/IA/3180)
This publication has 59 references indexed in Scilit:
- High Aspect-Ratio, Fully Conducting Gold Micropillar Array Electrodes: Silicon Micromachining and Electrochemical CharacterizationThe Journal of Physical Chemistry C, 2012
- Experimental and modeling analysis of the formation of cuprous intermediate species formed during the copper deposition on a rotating disk electrodeElectrochimica Acta, 2010
- Effect of Additives on Shape Evolution during ElectrodepositionJournal of the Electrochemical Society, 2007
- Molecular dynamics—Monte Carlo hybrid simulation of thin film growth and void formation in electrodeposition processMolecular Simulation, 2007
- Manufacturing costs for microsystems/MEMS using high aspect ratio microfabrication techniquesMicrosystem Technologies, 2006
- Stochastic Simulation of the Early Stages of Kinetically Limited ElectrodepositionJournal of the Electrochemical Society, 2006
- Modeling Superconformal Electrodeposition Using The Level Set MethodJournal of the Electrochemical Society, 2003
- Superconformal Electrodeposition in Submicron FeaturesPhysical Review Letters, 2001
- Simulation of Shape Evolution during Electrodeposition of Copper in the Presence of AdditiveJournal of the Electrochemical Society, 2001
- Local refinement of three-dimensional finite element meshesEngineering with Computers, 1997