3D-IC Chiplet Integrated Power Supply With LDO, SCVR, and Buck DC–DC Converter
- 22 October 2025
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Solid-State Circuits Letters
- Vol. 8, 341-344
Abstract
With the rapid advancement of chiplet and heterogenous integration technologies, delivering power through the package, RDL, and chip layers in three-dimensional space has become a fundamental challenge for high-performance SoCs. This paper provides a comprehensive overview of power delivery solutions, including LDOs, switched capacitor converters, and Buck converters. It further details and compares advanced techniques such as novel conversion topologies, control schemes, optimization strategies, and integration strategies, offering insights into overcoming the power wall in emerging 3D-ICs.Keywords
Funding Information
- STIC (QYJS20232600B)
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