Reliability of industrial packaging for microsystems
Authors:
- R. de ReusRRR. de Reus
- C. ChristensenCCC. Christensen
- S. WeichelSWS. Weichel
- S. BouwstraSBS. Bouwstra
- J. JantingJ. Janting
- G. Friis EriksenGEG. Friis Eriksen
- K. DyrbyeKDK. Dyrbye
- T. Romedahl BrownTBT. Romedahl Brown
- J.P. KrogJKJ.P. Krog
- O. Søndergård JensenOJO. Søndergård Jensen
- P. GravesenPGP. Gravesen
- 1 June 1998
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 38 (6-8) , 1251-1260
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
- Silicon-to-silicon wafer bonding using evaporated glassSensors and Actuators A: Physical, 1998
- Protective coatings in harsh environmentsJournal of Micromechanics and Microengineering, 1996
- Packaging of physical sensors for aggressive media applicationsJournal of Micromechanics and Microengineering, 1996
- A new piezoresistive pressure transducer principle with improvements in media compatibilityJournal of Micromechanics and Microengineering, 1996
- Wafer through-hole interconnections with high vertical wiring densitiesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1996
- Photolithography on micromachined 3D surfaces using electrodeposited photoresistsSensors and Actuators A: Physical, 1995
- Encapsulated micro mechanical sensorsMicrosystem Technologies, 1994
- Amorphous silicon carbide and its application in silicon micromachiningSensors and Actuators A: Physical, 1994
- Silicon-to-silicon anodic bonding with a borosilicate glass layerJournal of Micromechanics and Microengineering, 1991
- Tantalum-based diffusion barriers in Si/Cu VLSI metallizationsJournal of Applied Physics, 1991