Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni–P/Sn–3.5Ag solder joint
- 1 May 2006
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 423 (1-2) , 175-179
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
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