Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates
Authors:
- M.A.A. Mohd SallehMSM.A.A. Mohd Salleh
- S.D. McDonaldSMS.D. McDonald
- K. NogitaK. Nogita
- 1 April 2017
- journal article
- Published by Elsevier in Journal of Materials Processing Technology
- Vol. 242, 235-245
Abstract
No abstract availableThis publication has 21 references indexed in Scilit:
- Non-Metal Reinforced Lead-Free Composite Solder Fabrication Methods and its Reinforcing Effects to the Suppression of Intermetallic Formation: Short ReviewApplied Mechanics and Materials, 2013
- Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solderMaterials Science and Engineering: A, 2013
- Mechanical properties of Sn–0.7Cu/Si3N4 lead-free composite solderMaterials Science and Engineering: A, 2012
- Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solderMaterials Science and Engineering: A, 2012
- Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substratesMaterials Science and Engineering: B, 2010
- Effects of ZrO2 nanoparticles on the mechanical properties of Sn–Zn solder joints on Au/Ni/Cu padsJournal of Alloys and Compounds, 2009
- Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packagesMaterials Science and Engineering: A, 2008
- Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure ConditionsMATERIALS TRANSACTIONS, 2005
- Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrateJournal of Electronic Materials, 2003
- Behavior of ceramic particles at the solid- liquid metal interface in metal matrix compositesMetallurgical Transactions A, 1988