Carrier Systems for Collective Die-to-Wafer Bonding
Authors:
- 1 May 2022
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 2058-2063
Abstract
Several alternative carrier systems for collective die-to-wafer transfer, using the laser debonding technique, are evaluated. The principles of laser debonding are explained and applied to thin die transfer. A so called ‘acoustic’ layer needs to be present to avoid damage to the dies during the laser ablation process. The benefits and disadvantages of applying this layer to the glass carrier system rather than to the dies prior to singulation are explained. Three alternative carrier systems, based on BrewerBOND® C1301-50 material and BrewerBOND® T1107 release material, are designed and evaluated for die placement, protective layer strip, collective bonding and finally laser debonding. A quantitative analysis and comparison with a reference system containing the release layer and acoustic layer on the die prior to singulation is presented.Keywords
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