Role of heat in post-silicon electronics

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Abstract
Managing heat is a major challenge in modern silicon-based computers due to both large static and dynamic power dissipations. There is a growing perspective that heat can serve as an information carrier (instead of being treated as a useless by-product) in post-silicon devices, enabling new functions and on-chip energy recycling. In this review, we introduce how heat can be utilized as a degree of freedom in electronic devices, and how such devices may enable efficient computers.
Funding Information
  • U.S. Department of Energy (N/A)
  • National Research Foundation of Korea (2023R1A2C2005159)
  • National Research Foundation of Korea (RS-2023-00216992)
  • National Research Foundation of Korea (RS-2023-00216619)
  • National Research Foundation of Korea (RS-2024-00507422)
  • Bundesministerium für Forschung, Technologie und Raumfahrt (16ME0398K)

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