Nobuki Hiramatsu
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Nobuki Hiramatsu has a total of 9 co-authors. Here are the top co-authors by number of shared publications:
Ayaka Yoshimaru
Shiga Yasu Plant, Kyocera Corporation, Yasu, Japan
1 shared publicationHiroki Omori
Keihanna Research Center, Kyocera Corporation, Kyoto, Japan
1 shared publication- Issei Watanabe
National Institute of Information and Communications Technology, Tokyo, Japan
1 shared publication - Jihoon Kim
Minatomirai Research Center, Kyocera Corporation, Yokohama, Japan
1 shared publication - Kunio Sakakibara
Department of Electrical and Mechanical Engineering, Nagoya Institute of Technology, Nagoya, Japan
1 shared publication - Momoka Tahira
Kirishima Research and Development Center, Kyocera Corporation, Kagoshima, Japan
1 shared publication
Latest Publications
- 19 February 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 73 (9) , 5897-5908
Loss Evaluation of Microstrip Line Using Low-Loss Olefin-Based Resin Build-Up Film in 160-GHz Band
A new film material, MW300, that is both compatible with build-up processes and capable of maintaining low dielectric loss, has been developed. Measurements of the dielectric properties of MW300 in the subterahertz band exhibited a loss tangent, tan δ of 0.0022 at 160 GHz, demonstrating lower loss compared to conventional build-up compatible organic materials. Analysis of the transmission loss in microstrip lines (MSLs) indicated that dielectric loss is more dominant than conductor loss in the subterahertz region, suggesting that using low-dielectric-loss materials is effective in reducing transmission loss. MSLs were fabricated on build-up substrates using both conventional materials and MW300. Measurements of the transmission loss confirmed the analytical predictions. The MSL using MW300 achieved a low-loss measurement result of 0.10 dB/mm in the 160-GHz band.
- 19 February 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 73 (9) , 5897-5908
Loss Evaluation of Microstrip Line Using Low-Loss Olefin-Based Resin Build-Up Film in 160-GHz Band
A new film material, MW300, that is both compatible with build-up processes and capable of maintaining low dielectric loss, has been developed. Measurements of the dielectric properties of MW300 in the subterahertz band exhibited a loss tangent, tan δ of 0.0022 at 160 GHz, demonstrating lower loss compared to conventional build-up compatible organic materials. Analysis of the transmission loss in microstrip lines (MSLs) indicated that dielectric loss is more dominant than conductor loss in the subterahertz region, suggesting that using low-dielectric-loss materials is effective in reducing transmission loss. MSLs were fabricated on build-up substrates using both conventional materials and MW300. Measurements of the transmission loss confirmed the analytical predictions. The MSL using MW300 achieved a low-loss measurement result of 0.10 dB/mm in the 160-GHz band.