Sunghwan Park
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Sunghwan Park has a total of 42 co-authors. Here are the top co-authors by number of shared publications:
Akihiro Egami
Panasonic Industry Company Ltd., Tokyo, Japan
2 shared publications- Chenxin Liu
Department of Electrical and Electronic Engineering, Institute of Science Tokyo, Tokyo, Japan
2 shared publications Hiroshi Taneda
Shinko Electric Industries Company Ltd., Nagano, Japan
2 shared publications- Hiroyuki Sakai
Department of Electrical and Electronic Engineering, Institute of Science Tokyo, Tokyo, Japan
2 shared publications - Issei Watanabe
National Institute of Information and Communications Technology, Tokyo, Japan
2 shared publications Jun Sakamaki
Department of Electrical and Electronic Engineering, Institute of Science Tokyo, Tokyo, Japan
2 shared publications
Latest Publications
- Open Access
- 3 March 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Journal of Solid-State Circuits
- Vol. 61 (4) , 1275-1293
A 142–164-GHz Phased-Array AiP Module With High-Power-Density and High-Efficiency Transceiver in 65-nm CMOS for 6G UE
This work presents a D-band high-power-density four-element phased-array transceiver for 6G user equipment (UE). Conventional designs require large multi-stage LO generation circuits for D-band up/down conversion, making it difficult to achieve compact size and low-power consumption. To address this, we propose an integrated LO chain using an injection-locked tripling phase shifter (ILTPS), which enables both frequency tripling and phase shifting within a single circuit without multi-stage amplifiers. The ILTPS achieves an area of 0.088 mm2 and a power consumption of 15 mW. In addition, to realize high power density, the transceiver integrates a bi-active sub-harmonic mixer (BA-SHM) and a D-band PA/LNA with PA-sharing TDD switching. An eight-element antenna-in-package (AiP) module using two transceiver ICs operates in the 142–164-GHz frequency range, achieving an EIRP of 25.7 dBm and a maximum data rate of 56 Gbps. The power consumption per element is 150 mW in TX mode and 93 mW in RX mode with 1 V VDD. The active area of this transceiver is 8.5 mm2, and it is implemented using a 65 nm CMOS process.
- 3 March 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Journal of Solid-State Circuits
- Vol. 61 (4) , 1275-1293
Open AccessA 142–164-GHz Phased-Array AiP Module With High-Power-Density and High-Efficiency Transceiver in 65-nm CMOS for 6G UE
This work presents a D-band high-power-density four-element phased-array transceiver for 6G user equipment (UE). Conventional designs require large multi-stage LO generation circuits for D-band up/down conversion, making it difficult to achieve compact size and low-power consumption. To address this, we propose an integrated LO chain using an injection-locked tripling phase shifter (ILTPS), which enables both frequency tripling and phase shifting within a single circuit without multi-stage amplifiers. The ILTPS achieves an area of 0.088 mm2 and a power consumption of 15 mW. In addition, to realize high power density, the transceiver integrates a bi-active sub-harmonic mixer (BA-SHM) and a D-band PA/LNA with PA-sharing TDD switching. An eight-element antenna-in-package (AiP) module using two transceiver ICs operates in the 142–164-GHz frequency range, achieving an EIRP of 25.7 dBm and a maximum data rate of 56 Gbps. The power consumption per element is 150 mW in TX mode and 93 mW in RX mode with 1 V VDD. The active area of this transceiver is 8.5 mm2, and it is implemented using a 65 nm CMOS process.
- 27 October 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 74 (1) , 547-559
Co-Design of Thermal and RF Performance in a Stacked Sub-THz Antenna-in-Package With Embedded Endfire Arrays
Sub-terahertz (Sub-THz) communication systems are a promising technology for next-generation high-speed, high-capacity wireless networks. Achieving this requires highly integrated antenna-in-package (AiP) solutions combining antennas and radio frequency integrated circuits (RFICs). However, high-frequency operation and dense integration increase RFIC heat density, potentially degrading AiP performance and reliability. This article proposes a sub-THz AiP with both excellent RF and thermal performance. The design features a multilayer antenna structure on a low-loss dielectric substrate, minimizing RFIC-to-antenna connections and radiating toward the substrate edge. A dual-sided heat dissipation structure is also introduced for efficient thermal management in stacked configurations. Validation through simulations and measurements confirmed good reflection characteristics ( $\vert $ S $11\vert \lt $ –10 dB), 15 dBi gain, and thermal resistance below 4.1 K/W. 2-D beam steering was also demonstrated, highlighting the effectiveness of the proposed co-design approach.
- 27 October 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 74 (1) , 547-559
Co-Design of Thermal and RF Performance in a Stacked Sub-THz Antenna-in-Package With Embedded Endfire Arrays
Sub-terahertz (Sub-THz) communication systems are a promising technology for next-generation high-speed, high-capacity wireless networks. Achieving this requires highly integrated antenna-in-package (AiP) solutions combining antennas and radio frequency integrated circuits (RFICs). However, high-frequency operation and dense integration increase RFIC heat density, potentially degrading AiP performance and reliability. This article proposes a sub-THz AiP with both excellent RF and thermal performance. The design features a multilayer antenna structure on a low-loss dielectric substrate, minimizing RFIC-to-antenna connections and radiating toward the substrate edge. A dual-sided heat dissipation structure is also introduced for efficient thermal management in stacked configurations. Validation through simulations and measurements confirmed good reflection characteristics ( $\vert $ S $11\vert \lt $ –10 dB), 15 dBi gain, and thermal resistance below 4.1 K/W. 2-D beam steering was also demonstrated, highlighting the effectiveness of the proposed co-design approach.