Processor Design in 3D Die-Stacking Technologies
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- 20 August 2007
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Micro
- Vol. 27 (3) , 31-48
Abstract
Three-dimensional integration is an emerging fabrication technology that vertically stacks multiple integrated chips. The benefits include an increase in device density; much greater flexibility in routing signals, power, and clock; the ability to integrate disparate technologies; and the potential for new 3D circuit and microarchitecture organizations. This article provides a technical introduction to the technology and its impact on processor design. Although our discussions here primarily focus on high-performance processor design, most of the observations and conclusions apply to other microprocessor market segments.Keywords
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